Clemson University holds paperboard packaging seminar

Twelve packaging industry participants attended a comprehensive 2-day paperboard packaging seminar on the campus of Clemson University to learn about the entire paperboard packaging process.

Lauren R. Hartman, Senior Editor -- Packaging Digest, 10/12/2009 2:53:00 PM

Twelve packaging industry participants attended a comprehensive 2-day paperboard packaging seminar in late September/early October at the Sonoco Institute of Packaging Design and Graphics on the campus of Clemson University, Clemson, SC.

The seminar covered the entire paperboard packaging process, from raw material choices to package design, printing, converting, and sustainability. Descriptions of the substrate classes from SBS to coated recycled board and unbleached kraft and the attributes of strength, appearance and printability to converting factors helped clear up the questions common to all who are new to the industry as well as the experienced who now find themselves in new areas of packaging.

The details that affect improvements in sustainability were explained and participants were engaged in the analysis of current packaging solutions to apply and test their new knowledge. A primer on the major printing processes and paperboard attributes as they affect print quality was a major segment of the class.

Directed by Dr. Dan Malenke, PKGPRO, LLC, the seminar included presentations from Ken Perry, Kapstone Charleston Kraft; Pat Shields, Rock-Tenn Co. and Phil Bradley, MWV.

This course was built on the 20 years of experience when Malenke, formerly of MeadWestvaco, took a similar course to more than 13,000 industry professionals in 22 countries.  Attendees came from six states and Canada, representing Fleetwood-Fibre Packaging & Graphics; Graphic Packaging International.; Independent Printing Company; MWV; Nosco, Inc.; Outlook Group Corporation; Rock-Tenn Company; Rosmar Packaging Corp.; and Pacific Southwest Container.

One participant stated, “This was extremely valuable. I had some background in packaging, however, this seminar gave me a better understanding of the entire process from start to finish.”

Based on the success of this event, another such seminar with hands-on learning and real-life application is being planned for January 27 to 28, 2010, at Clemson University. For more information, visit www.clemson.edu/centers-institutes/sonoco/; or http://www.pkgpro4u.com