3-dimensional (3D) packaging technologies exploit the third or Z height dimension to provide a volumetric packaging solution for higher integration and performance. 3D packaging has become critical to integrating the multi-media features consumers demand in smaller, lighter products. This increasing functionality requires higher memory capacity in more complex and efficient memory architectures.
New product designs (cell phones, digital cameras, PDAs, audio players and mobile gaming) demand that these features be delivered in innovative form factors and styling. 3D packaging is experiencing high growth and new applications by delivering the highest level of silicon integration and area efficiency at the lowest cost.
The critical 3D platform technologies include:
- Design rules and infrastructure for thinner, high density substrate technologies
- Advanced wafer thinning and handling systems
- Thinner die attach and die stacking processes
- High density and low loop wire bonding
- Pb free and environmentally conscious "Green" material sets
- Flip chip plus wire bond mixed technology stacking
- Turnkey die and package stacking assembly and test flows